Used DISCO DCS 141 #293642331 for sale

DISCO DCS 141
Manufacturer
DISCO
Model
DCS 141
ID: 293642331
Wafer spinner.
DISCO DCS 141 is an innovative, advanced wafer and mask scrubber that makes semiconductor production faster and more efficient. It is specifically designed to quickly and thoroughly clean both wafers and masks with the utmost speed and accuracy. DISCO DCS141 consists of a high-resolution, three-axis table, a 6″ scrubber head, and a double-sided containment unit. The three-axis table permits users to precisely manage the scrubbing process, allowing for targeted, quick and efficient cleaning of wafer surfaces. It also provides high accuracy, with an independent axis-by-axis movement. In addition, DCS 141 has a 6″ scrubber head which operates at a maximum of 600rpm. This enables the scrubbing of masks and substrates with different thicknesses and are broadly used for operations such as alignment, cleaning, reticle and plate attach, mask grinding and other semiconductor related processes. This robust scrubbing system is reliable and highly efficient, providing the highest level of quality and reduced production time. The double-sided containment unit of DCS141 is contained in a stainless steel housing with a highly ventilated design. This eliminates the risk of particulate release and contamination, meaning that wafers and masks are effectively cleaned in a contained environment. This ensures a high-level of safety for both people and equipment. DISCO DCS 141 offers flexible scrub angles, ranging from -30 degree to +30 degree of scrubbing on both the X and Y axes. It offers a wide range of excursions and adjustable stall speeds that are easily adjustable. DISCO DCS141 is also highly automated, allowing users to set up area and pattern specific scrubbing protocols that are optimized for the purpose of the scrubbing process. DCS 141 is an efficient and cost-effective wafer and mask scrubber system that offers users a high degree of accuracy, reliability, safety and efficiency. It is an optimal tool for increased productivity, improved quality and reduced downtime in semiconductor production.
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