Used DISCO DCS 141 #9096535 for sale

DISCO DCS 141 is a fully automated wafer and mask scrubber designed to improve the quality of substrates and enhance device yield rates. It provides uniformed cleaning of silicon wafers and photomasks used in semiconductor fabrication, utilizing a two-spray rotational scrubbing process. DISCO DCS141 uses a single brush to drive the wafer/mask over the cleaning module, while two spray jets continuously spray cleaning fluid. As the wafer or mask travels down the cleaning module, it is simultaneously scrubbed and rinsed with ultrapure water. DCS 141 features a unique two-stage scrubbing system. First, it pre-soaks the wafer prior to scrubbing, allowing the cleaning solution to penetrate deposits on the surface of the wafer. Then, as the wafer travels down the cleaning module, the dual spray jets simultaneously utilize synchronized high-pressure scrubbing and low-pressure rinse actions which dislodges surface contaminants and uncondensed particles. In addition to ultrasonic cleansing of the wafer/mask, DCS141 features a centrifugal drying system. As the wafer/mask passes down the cleaning module, air is forced through a series of nozzles, rapidly evaporating the cleaning solution and drying the wafer/mask simultaneously. This drying system prevents any liquids from becoming entrapped between the microetchings of the semiconductor wafer/mask. DISCO DCS 141 is equipped with a conveyor belt which can hold up to three wafers/masks in each cycle. The wafers/masks can be of various sizes, shapes and thicknesses. The scrubbing performance of DISCO DCS141 can also be adjusted to match the size and type of wafer/mask being cleaned. DCS 141 is equipped with a LAB/QC (Quality Control) mode, allowing for the user to configure the scrubber for carrying out wafer/mask cleaning validation tests. The LAB/QC mode exhibits better process repeatability and repeat accuracy, with the results providing detailed information on residue removal, surface area coverage, contamination levels and other vital process parameters. DCS141 is also available with a touchscreen control panel providing easy access to programming parameters such as the scrubbing speed, scrubbing pressure, water flow rate, drying time and other operating parameters. This makes it easier than ever to set the scrubber up to fit the needs of the user. DISCO DCS 141 is designed with an intuitive user interface with a dedication to safety and reliability, and offers a highly reliable and efficient automated solution for cleaning silicon wafers and photomasks used in the semiconductor fabrication process.