Used LAM RESEARCH DSS 200 Series II #9180956 for sale

LAM RESEARCH DSS 200 Series II wafer and mask scrubber is a specialized equipment designed to clean semiconductor wafers and masks before further processing. It removes particles and cleans the surface of the wafers, which is a key first step in the semiconductor production process. The unit features a state of the art ultrasonic scrubbing technology, which is the most efficient means available for cleaning wafers. The DSS 200 scrubber has a 10 liter scrubbing tank and is designed for full chemistry compatibility. It has an integrated overhead lifting system for larger diameter wafers, allowing for easier loading and unloading. The scrubbing unit is designed to reduce particle generation with its low-velocity stainless steel nozzles and compliant scrubbing motion. The nozzles are capable of producing an adjustable cleaning cycle from 0.2 to 8 minutes, as well as a variable scrubbing power from 10 to 30 Pulses Per Second (PPS). The machine has a built-in notification tool that alerts operators when maintenance needs to be performed, and offers an easy to read OLED display panel to adjust parameters and control the scrubbing cycle. The touch screen allow users to view, adjust, and save their settings for future use, helping to reduce the time spent configuring it for each use. Additionally, the asset features a built-in wafer vacuum model to collect any residue left from the cleaning cycle. The DSS 200 is capable of handling non-conventional wafer sizes and is able to accept notched ISE (Integrated Silicon Edge) 75mm x 100mm to 200mm wafers without special fixtures. This feature improves the efficiency of the scrubbing equipment since conventional wafer sizes require fitting adaptors. Additionally, it has a nominal water temperature range of 30 to 60 degrees Celsius with an adjustable temperature range of 0 to 75 degrees Celsius. In conclusion, DSS 200 Series II Wafer & Mask Scrubber is an effective and reliable system for removing particles from wafers and masks before further processing. The unit is designed for chemistry compatibility, has an adjustable cleaning cycle, and is capable of handling various wafer sizes. With these features the machine helps to reduce wafer processing time and improve throughput efficiency.