Used SSEC 3305 #9082398 for sale

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Manufacturer
SSEC
Model
3305
ID: 9082398
Wafer Size: 8"
Vintage: 2012
Wet etching system, 8" 108" Wide x 78" Deep x 105" High, 300 Series SS, white epoxy painted inside and outside PC based user interface with local data storage, SQL based data base - Air Ionizer ULPA air filtration Concentrated chemical containment for 3305 SECS/GEM software for host interface SEMI compliant, ETL listed, CE marked Robotic Wafer Handler: Robot: Vertical, Rotary, 2-Radial Axis Vacuum paddle with flip Wafer scanner with CCD camera for detecting double and cross slotted wafers Wafer alignment with CCD camera, image processing Horizontal Cassette Loading, (2) Cassettes Process Chambers: Halar Chamber, 18" inside diameter CCD Camera for end point detection and video archive Exhaust Pressure Sensor Cover interlock sensor Integrated Spin Chuck Wafer Lift Mechanism Dispense Arm 1: LPD - Etch Solution - HF:Nitric:Sulfuric:Phosphoric:H2O (1:24:4:8:3) Dispense A: High Flow Stream @ 1200ml/Min Dispense B: Fan Spray Purge Cup w/Dual Dispense lid - High Capacity ("Prime" Function to Recirculation Tank) Dispense Arm 2: LPD - DI Water Rinse Dispense A: High Flow Stream Dispense B: Fan Spray Dispense Arm 3: N2 heated dispense - with programmable 400W heater, 0.0003 micron filter Stationary Wall Mounted Dispense (1 nozzle each): Dispense A: Amb DI Water Collection Cup (for chemical separation): Open: Recirculated Etch Collection Closed: Chamber Drain Drain Diverter - Main Chamber Drain: Drain "A" = Acid Drain Drain "B" = Industrial Drain Wafer Thickness Inspection Station: Integrated ISIS Wafer Thickness Sensor and Wafer Measurement Software ISIS Sensor Indexing Arm for complete Edge to Edge Wafer Thickness Mapping Integrated Spin Chuck and Spin Motor CCD Camera for WaferChekTM measurement of Via reveal Plumbing Package: Etch 1: Chem Supply, Mixing, Dispense and Collection - HF: Nitric: Sulfuric: Phosphoric: H2O (1:24:4:8:3) Metering package to support Five Part Mixing - for Four tanks, 1 mix 1 spike Valving package to support Five Part Mixing - for Four tanks 6 Gallon Etch Recirculation Collection Tank - 1 fresh 1 dispense Recycled Etch Filter - 1 micron Bulk Chemical Supply Interface Triple Circuit Heat Exchangers - 40C ±2°C @1200ml Per Min Levitronics Pumps Neslab Heater/Chiller Etch 2: Additional Chemical Supply, Mixing, Dispense and Collection System Metering package to support Five Part Mixing - for Four tanks, 1 mix 1 spike Valving package to support Five Part Mixing - for Four tanks 6 Gallon Etch Recirculation Collection Tank - 1 fresh 1 dispense Recycled Etch Filter - 1 micron Bulk Chemical Supply Interface Triple Circuit Heat Exchangers - 40C ±2°C @1200ml Per Min Levitronics Pumps Neslab Heater/Chiller Drain Diverter (For Collection Cup): Drain "A" = Etch Solution "A" Recirculation Drain "B" = Etch Solution "B" Recirculation Drain "C" = Acid Drain With resistivity monitors Purge Cup w/Dual Dispense Collection Path High Capacity (with "Prime" Function) Dispense Arm Reconfigured with Two Stream Dispenses (Etch A/B). No Fan Sprays Etch 3: Pre-Mixed Etch, Single-Pass, Bottle-Feed, into Chamber #2 Only Etch Spin Tooling: 8" Back Side Gas Seal Chuck with Self Retracting Lift Pins 208 VAC, 3 Ph, 60 Hz, 30 A Currently installed 2012 vintage.
SSEC 3305 wafer and mask scrubber provides a high-level of cleaning performance utilizing patented dual-action technology. This high-tech wafer scrubber provides an optimal clean for the removal of particulate, contamination, and photoresist from wafers up to 300-mm in diameter. The scrubber is designed to be used for high-volume batch production, product transfers, and to provide a verified clean process prior to exposure. The scrubber is equipped with two independently operated rotating cleaning heads that rotate in opposite directions. The primary abrasive pad and wiping blade provides a highly efficient and effective cleaning action. The abrasive pad provides multi-directional cleaning with a large surface area of contact combined with a contouring action that follows the profile of the wafer surface. The brushing action gently agitates the wafer surface to remove contaminants, while the wiping action capture contaminants in a clean wiping agent. The wiping action is further augmented by an integrated vacuum system. The scrubber also includes advanced contaminant sensing and monitoring systems. This includes a customized particle monitoring system that detects and monitors the particulates released as a result of the scrubbing and/or cleaning processes. Additional monitoring systems control and report the scrubbing parameters such as scrub times, and the consistency of the wipes against the wafer surface. The scrubber is easy to operate, using an integrated human-machine interface (HMI). The HMI allows for easy and efficient parameter input, as well as access to the scrubber's monitored data and cleaning reports. The scrubber is also designed for easy and safe maintenance and inspections. 3305 wafer and mask scrubber is an essential tool for providing optimal cleanliness at the highest level of production and cleaning performance. The scrubber utilizes advanced dual-action technology and contamination sensing systems to provide easy and reliable operation, as well as maximum cleanliness and reliability when processing wafers up to 300-mm in diameter.
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