Used KLA / TENCOR Candela CS20 #9185991 for sale
It looks like this item has already been sold. Check similar products below or contact us and our experienced team will find it for you.
Tap to zoom
Sold
ID: 9185991
Wafer Size: 2"-8"
Vintage: 2010
Defect inspection system, 2"-8"
Cassette handling:
Standard: Single puck with up to 8" cassette handler capability
Option: Dual cassette configuration for wafer sorting
Illumination source : 8 mW, 635nm wavelength red laser
Operator interface : Trackball and keyboard standard
Substrate thickness : 350 ~1,100 µm
Substrate material : Any clear or opaque polished surface
Surface topography(on Bare Substrates) : > 2 Å;; Ra
Film Thickness Uniformity (Single Uniformity) (Single Layer Only Sensitivity) : 5 Å;; < Thermal Oxide < 1000 Å;;
Repeatability (Count) CV < 5.0%
Edge Exclusion Imaging: No exclusion
Defect Analysis: User configurable, varies with wafer size
(nominal: 2 in. = 1.5 mm, 8 in. = 5 mm)
R-θ Coordinates KLARF file (XY coordinate) output is also available
Coordinate Precision: 80th percentile < 150 μm
Coordinate Accuracy: 80th percentile < 150 μm Spatial Resolution > 10 μm spa
Ring and vaccum holder: 2"
Currently installed and stored in clean room
2010 vintage.
KLA / TENCOR Candela CS20 is an advanced mask and wafer inspection equipment designed for submicron lithography applications. It utilizes patented line-of-sight (LOS) technology to produce high resolution, accurate results. The system is capable of producing images with feature recognition down to 30 nm. The CS20 utilizes an ultraviolet imaging unit to detect defects and variations in patterns on the wafer, mask, and other substrates. The line-of-sight (LOS) technology provides operators with long-term image accuracy and repeatability. The machine is capable of reducing time and cost associated with managing low-defect optical motion systems. The CS20's modular architecture allows it to be configured for a variety of use cases. It also supports a wide range of overlay and inspection application modules. Its integrated illumination tool increases accuracy of inspection and reduces the number of false positives. The CS20's visual inspection and defect recognition capabilities are unsurpassed. It uses a multi-spectral exposure platform to detect defects with various sizes, shapes, and intensities. With its advanced dark-field imaging capabilities and automated defect recognition, operators can rapidly identify patterns in a visual form. The asset is computer-controlled and operates with a high level of repeatability and accuracy. The high-resolution images from the CS20 are well suited for automated defect review and classification processes. The CS20's automated inspection algorithms enable it to detect defects without manual review. It also supports other mask and wafer inspection activities, such as wafer maintenance, process control, and scanning. Its open architecture allows for easy integration with external systems. The model also provides a robust software suite that includes comprehensive data analysis and visualization capabilities. It offers a range of software modules and applications for managing, calibrating, inspecting, and analyzing data. The software also includes support for third-party applications, which can enable a broader range of automated functions. KLA CANDELA CS-20 is a state-of-the-art mask and wafer inspection equipment that provides unmatched performance in submicron lithography applications. This system is highly customizable and provides industry-leading defect detection and data analysis capabilities. It can be used to detect and classify defects with superior accuracy and repeatability, reducing time and cost associated with managing inspection activities.
There are no reviews yet