Used SEMICONDUCTOR EQUIPMENT CORP 83B #9156723 for sale

SEMICONDUCTOR EQUIPMENT CORP 83B is a high-precision bonding machine, designed for the electronics industry. It is capable of making superior electrical connections between components without the need for soldering. This type of equipment is used to assemble, encapsulate and connect a wide array of semiconductor devices such as LEDs, diodes, transistors, resistors, capacitors, and ICs. The equipment is composed of an automated system with a fully digital architecture, and a variety of accessories for comprehensive control. The system includes the Bond Placer, which holds electronic components in place and bonds them together with precise force and pulse widths. This forms reliable metallic bonds without the need for manual soldering. It also has an indexed chuck to ensure parts are accurately aligned for accurate positioning and spot welding. The machine also includes a CCD camera to monitor the work process, providing visual images of the parts being bonded together. This allows operators to monitor the process and ensure the quality of the finished products. 83B also includes a micro-designed Stage for precision control of components. The Stage is outfitted with micro-precise linear motors and indexers to ensure accurate positioning. It also includes controlled temperature cycles to maintain uniformity of surface temperatures, and advanced monitoring hardware to assist with compliance testing. Overall, SEMICONDUCTOR EQUIPMENT CORP 83B is an advanced and precise bonding machine designed to meet the needs of the electronics industry. It incorporates a state-of-the-art technology to ensure the highest quality electrical connections between components without the need for manual soldering. The equipment has a variety of features to provide superior precision while also ensuring user safety, and it can be used to accurately and reliably bond various semiconductor components.