Used DAGE XD 7500 #9311913 for sale

DAGE XD 7500 is an x-ray equipment designed for advanced circuit analysis of interconnects and package assemblies. It is ideal for applications such as failure analysis, characterization of solder joint integrity and die and wire bond integrity. XD 7500 combines both imaging and tomography for detailed x-ray analysis and uses a combination of multi-magnification optics, an advanced detector, and a high-performance X-ray source. The system is designed with a large field of view and deep focus for precise imaging of the smallest interconnects and package assemblies with sub-micron resolution. With its high resolution and sensitivity, the unit can detect even micro-opaque materials. The machine is specifically designed to be easy to use with user-friendly software, intuitive image analysis tools, a remote laptop connection and an onboard video monitor. DAGE XD 7500 also has advanced imaging modes including dual-energy subtraction, or Edge Enhancement, making it ideal for feature enhancement and defect detection. It also includes advanced algorithms for particle analysis, including particle- size, shape, and count analysis. XD 7500 is a perfect choice for experts in various industries such as microelectronics, optoelectronics, medical and automotive, for finding a broad range of failure types including opens, shorts, delamination, contamination, warpage, misalignment, and fatigue. The tool is also designed with an environmental chamber integrated into the x-ray enclosure which provides temperature and relative humidity control necessary to reduce shock due to thermal stress. The asset is also compliant with safety regulations and can be set-up for either industrial or laboratory use. Its modular design simplifies maintenance and allows for easy integration of other components into the model. Overall DAGE XD 7500 is an advanced x-ray equipment designed to provide high-quality imaging and tomography capabilities. Its high resolution, sensitivity, ease-of-use, and reliability make it an ideal tool for detailed x-ray imaging and analysis of interconnects and package assemblies.