Used BESI / ESEC Equipment for sale

BESI is a leading provider of semiconductor assembly equipment solutions, specializing in die attachers, bonders, and other related products. With a history dating back several decades, BESI has established itself as a trusted and innovative industry player. The company's die attachers are renowned for their precision and reliability. These machines enable the bonding of individual semiconductor chips onto a substrate, ensuring optimum functionality and performance. BESI's die attachers are equipped with advanced technologies such as auto-loading and auto-tool change capabilities, making the manufacturing process more efficient and cost-effective. In addition to die attachers, BESI offers a range of bonders, which are essential in connecting the die to the packaging substrate. These bonders utilize specialized techniques like wire bonding or flip-chip bonding to ensure strong and reliable connections within the semiconductor package. BESI bonders are known for their high precision and exceptional speed, enabling manufacturers to meet stringent quality standards and reduce production lead times. Moreover, BESI excels in providing comprehensive solutions that include both equipment and processes, enabling seamless integration and improved production efficiency. The company's commitment to customer satisfaction has driven continuous innovation, resulting in cutting-edge technologies that meet the evolving demands of the semiconductor industry. With a rich history and a diverse product portfolio, BESI has established itself