Used ESEC 3088iP #153944 for sale

ESEC 3088iP bonder is an automatic, precision bonder for the precision alignment and permanent jointing of various interconnected components. It is designed for interconnecting optical, RF, and MCM components such as FPC/PCB boards, chip packages, semiconductor wafers, and other micro-electronics. ESEC 3088I P bonder's powerful high-precision imaging equipment, along with its precision alignment mechanisms and bonding heads, enable faster, more accurate alignments and high-quality joints. 3088 IP bonder has a large, modular design, making it easy to position bonds precisely. It is equipped with a high-resolution OLED monitor providing a simple and intuitive user interface. This enables the user to monitor and control all aspects of the bonding process in a single, compact device. The bonder has an advanced automated system for precision alignment, enabling faster, more accurate alignment and positioning. Its precision alignment mechanism features a stable electromechanical movement, which is designed to reduce assembly time while maintaining high accuracy. Its high-precision imaging unit consists of a high-speed CCD camera, which ensures fast and accurate positioning of substrates and components. A built-in image stitching algorithm allows images from multiple cameras to be combined into one high-resolution image. 3088iP bonder has a high-performance bonding head for making permanent joints. The bonding head is capable of making a wide range of joints, including heat, ultrasonic, solder, and adhesive-based bonding. The machine also features temperature control, which is designed to ensure accurate and consistent results. ESEC 3088 IP bonder is designed to be used in a wide range of industries, from medical to aerospace applications. It is also compliant with various ISO, SEMI and other standards. The bonder is designed to produce reliable, high-quality joints to meet the most demanding production requirements. 3088I P bonder can help manufacturers of all types increase throughput, reduce costs, and improve product reliability.