Used ESEC 3088iP for sale
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Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
116
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
98
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
96
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
102
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
97
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
112
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
127
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
146
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
94
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
106
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
103
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
113
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
119
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
95
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
134
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
105
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
102
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
110
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
122
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
109
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
108
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
103
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
113
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
144
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
96
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