Used ESEC 3088iP for sale
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Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
104
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
86
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
83
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
85
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
86
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
98
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
115
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
127
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
83
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
90
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
90
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
101
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
106
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
79
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
122
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
94
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
86
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
99
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
108
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
97
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
91
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
89
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
99
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
128
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
83
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