Used ESEC 3088iP for sale
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Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
350
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
267
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
292
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
268
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
275
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
297
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
254
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
257
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
289
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
298
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
256
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
287
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
256
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
252
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
327
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
284
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
279
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
258
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
278
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
292
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
301
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 Sigma) Typical sprint UPH: (11) W
278
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5μm (3 sigma) Typical sprint UPH: (11) Wi
303
Popular Product
ESEC
3088iP
Wire bonder Flying bondhead: Bond placement accuracy: ± 3.5 μm (3 sigma) Typical sprint UPH: (11) W
194
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