Used ESEC 3088iP #9091742 for sale
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ID: 9091742
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is a fully automated, low-volume, precision wire bonder capable of producing reliable, high-quality bonds. It utilizes a proprietary, high-speed multiple-step automatic process for silver, gold and aluminum wire bonding. ESEC 3088I P's superior design is able to target specific components, making it ideal for high density assemblies as well as large components. 3088 IP offers the highest accuracy for bonding and can perform repeatable, high speed, precise bond conditions. Featuring a four-axis head made of hardened steel with an advanced servo-controlled stop equipment, ESEC 3088 IP ensures that the bond force applied is constant and repeatable. The head is also designed with a target fitting system that allows for a more precise alignment of the bond pads, enabling perfect bonding results. 3088iP also features an intuitive user interface, a user friendly graphic operating unit, and a motion control machine with speed capabilities of up to 60 cycles per second. The tool is easy to learn and operate, and the user interface allows for set-up and programming quickly and easily. The graphical user interface offers error codes and visual feedback so that the user can check the status of the machine at any point. 3088I P is ideal for a variety of manufacturing environments, especially medical device, electrical/electronic, and automotive OEMs. It is one of the most reliable, accurate, and cost-effective wire bonders available on the market. The machine is designed to be reliable, flexible, and product and cost-effective. Therefore, it is the perfect choice for demanding, detailed wire bonding requirements.
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