Used ESEC 3088iP #9091780 for sale
URL successfully copied!
Tap to zoom
ID: 9091780
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter: 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (Adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is an advanced bonding equipment designed for rapid production of hermetic and non-hermetic seals. The system is built on intelligent control unit for user convenience and allows for high quality product outcome. This machine has a hermetic sealing arm that performs several operations including laser-based heating, pressing, and manual welding. The arm is further supported by a precision detector that locates the exact position of the seam and facilitates precise hermetic sealing. ESEC 3088I P has a process chamber loaded with the necessary tools and processes for efficient bonding, and includes a data control and visualization tool for process control and monitoring. The data control asset allows users to set parameters, monitor process statistics, and view simulation videos of the bonding processes. The process chamber is divided into two separate chambers, with each chamber having its own independent process control. The model features two independent laser heating systems, an accelerated AC linear head heating equipment for multi-step process control, and an adjustable AC impact welding system for complex processes. In addition, the unit includes a variety of tools and materials for complex process control in non-destructive packaging, such as coated, pre-molded, and pre-fabricated substrates. 3088 IP has an automatic feeder configuration that allows for quick and easy production set-up, and a customizable positioner for precise movement and fine-tuning of the bonding location and production speed. The machine is designed with a heated gas circulation tool for temperature control and temperature stability throughout the entire product. The process also features an adjustable temperature range for fine-tuning of the hermetic seal, and safety features to protect the asset from over heating. In addition, the model also includes an internal resistance welding equipment and a PLC control unit, which are designed to ensure a high level of accuracy and reliability throughout the production process. The internal configuration also features an advanced interface for quick production set up and control, and a variety of user friendly programming options. With its smart and advanced control system, ESEC 3088 IP is an excellent choice for high volume, repeatable production of hermetic seals and non-hermetic bonding solutions.
There are no reviews yet