Used ESEC 3088iP #9091734 for sale
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ID: 9091734
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (Adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is an advanced high-performance bonder that offers superior performance for industrial wire bonding operations. This state-of-the-art machine is designed to reduce the time it takes to complete fine to medium wire bonding operations. It has a compact and robust design that is capable of bonding high-purity gold, copper, aluminum, and other soft metal wires to substrates. ESEC 3088I P comes with a fully integrated servo controller and powerful motion stitching software that makes the machine exceptionally responsive to high-speed wire bonding operations. It features a high-precision optics package that is capable of capturing and resolving minute details for accurate and precise fine and medium wire bonding operations. The machine boasts an automated systems that ensure repeatable and precise bonding operation using a variety of materials. 3088 IP has a robust design that contains a maximum three-axis motion system, two independent modulation axes, and a magnetic levitation table. It also includes two attached bond head assemblies, one for axial wire bonding and one for radial wire bonding. The bond head assemblies are fitted with precision encoders that ensure accurate and repeatable bond position control. The machine features an array of automated features that offers advanced process solutions such as advanced process monitoring, adjustable process parameters, and repeatable process executions. It also includes an intuitive user interface with touchscreen navigation and easily programmed macros for improved operator ease of use. Overall, 3088iP is the ideal solution for any organization looking to achieve higher accuracy and quicker turnaround times during their wire bonding operations. It is beneficial in a wide range of sectors such as automotive, telecom, and medical devices, as well as other industries that require microelectronics' interconnects.
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