Used ESEC 3088iP #9091750 for sale
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ID: 9091750
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is a fully automated bonder/wedge bonder specifically designed for bigger production volumes at high speeds. It can execute all types of bonding sequences in a single machine, including gold, aluminium and copper wires in diameters from 0.001 to 0.30 mm, as well as special alloy wires. It also offers a wide range of connectivity options, making it extremely versatile and flexible when it comes to communicating with other machines and production systems. ESEC 3088I P has special features designed to maximize productivity and minimize defects. Its memory compression feature is designed to reduce data transfer time, ensuring faster machine cycle times. The SmartInteractivity feature enables the bonder to anticipate changes in production conditions and adjust the bonding process accordingly, making for improved productivity and accuracy. 3088 IP employs a three-stage wedge bonding approach for maximum accuracy, speed and durability. Its die-free programming interface simplifies the setting up process and reduces downtime to a minimum. The bonder also features a fast learning setting option, which reduces calibration time by as much as 50%. ESEC 3088 IP is capable of carrying out a wide variety of wedge bonding activities, including leading-edge devices, surface mount devices, thermistors, automotive and medical assembly components. It is also equipped with intelligent vision system and a proprietary sensing system to guarantee accuracy, flexibility, high velocity and repeatability. The brand takes safety of utmost importance and 3088I P is designed to meet high-level safety standards. It is embedded with several safety features including the Cage Enclosure, allowing access for maintenance and operations while maintaining a controlled access. Additionally, the bonder is designed to function with high-precision lead location and dual motion control, ensuring high-quality bond formation with minimal temperature rise and dimensional accuracy. The bonder is also safe to operate as it is equipped with intrusion detection, adjustable low limit settings and knob guards to prevent user errors. Overall, 3088iP is an extremely reliable and accurate bonder/wedge bonder that is perfect for assembling high-volume production components in a variety of different applications. Its wide range of connectivity, fast cycle times, intelligent vision system, safety features and precision bond formation make it an ideal solution for any production line.
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