Used ESEC 3088iP #9091756 for sale
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ID: 9091756
Vintage: 2003
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter: 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (Adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2003 vintage.
ESEC 3088iP is a reliable, fully programmable, and cost-effective bonder designed for high-volume production environments. It is equipped with two advanced, independently operated bonding heads, allowing for simultaneously bonding two separate components at the same time. ESEC 3088I P features a broad range of integrated features, including vision-guided, component-level placement accuracy for active components mounted on the same side of the printed board. The vision system enables the bonder to quickly and accurately locate components for high-speed bond placement. The bonder supports a range of bond styles, including thermocompression, wedge, and plasma. It is also capable of using both standard and miniature bond heads, and can accurately place parts down to the sub-micron range. 3088 IP has a modular design, allowing for various head types and configurations. It also features a library of stored bond setups and recipes that can be easily accessed and changed without needing to refit the system. With its large display screen, intuitive user interface, and on-board diagnostics, ESEC 3088 IP bonder simplifies the process of setting up and performing various tasks. In addition, its powerful servo motor system provides a high degree of accuracy when handling components of various sizes and shapes. 3088I P is also extremely versatile and provides excellent reliability, making it the perfect choice for various high-volume production application requirements. Highly flexible, it can be easily configured to meet the needs of different applications. Furthermore, its automated processes and intuitive user interface make running it easy to learn and use. This makes it easier for inexperienced operators to quickly become familiar with 3088iP's features. Lastly, its dynamic, non-static nature ensures a consistently high-quality bond, even when handling a wide range of components with various sizes and shapes.
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