Used ESEC 3088iP #9157573 for sale

ESEC 3088iP is an automated bonder equipment that offers high-precision wire bonding solutions for use in a wide range of industries, including the automotive and aviation industries. It is an ideal choice for high-volume production, thanks to its fast and precise operation, as well as its optimized integration with automation solutions and process monitoring. ESEC 3088I P comes with a powerful, user-friendly Windows-based system, allowing for a wide range of operational settings and easy integration into existing factory automation solutions. With its adaptable platform, the unit can be utilized for virtually any application, from ultra-micro-fine 34 AWG gold and aluminum bonding wires to larger format copper and gold wire assemblies. The machine offers high-precision wire bonding thanks to its encapsulated bonding head, consisting of a flat bondable base platen, a linear servo-motor, and the patented ESEC X-GAM Wire Bonding Control Machine. This technology ensures that the impedance of the bonded joint is continuously monitored and the correct wire feeding tension is maintained. The X-GAM also monitors the performance of the bond using sensors to verify the quality of the bonded wire. The tool also offers temperature control of up to four separate parameters to ensure optimal performance. Its Rapid Thermal Desaturation Asset helps optimize the process further by quickly cooling the bondable material prior to bonding, minimizing the risk of overheating. 3088 IP is also equipped with a vision model for optimal wire placement accuracy and alignment. This equipment offers three-axis of autonomous control with an encoder-based calibration process and offers line-of-sight alignment with advanced Programmable Z Touch Off, allowing for precise positioning of wires. In addition to its highly accurate bonding capabilities, the system also features a built-in vacuum unit to ensure high-speed removal of bonded wires and a single, separate bond head for improved access and operation. ESEC 3088 IP is an ideal choice for companies in need of reliable, high-precision bonder systems that offer optimized integration with automation solutions and process monitoring. Its easy-to-use platform and advanced features make it perfectly suited for the most demanding production environments.