Used ESEC 3088iP #9376841 for sale

ESEC 3088iP bonder is a dedicated automated wire bonding platform specifically designed for high-volume production of component chips and interconnects. The platform offers a host of features that provide reliable, efficient and repeatable results for a wide range of applications. The platform features a synchronous DC power supply with adjustable arc control settings, enabling precise bond parameters to be programmed for optimal and consistent results. It also includes integrated gamma control, allowing it to make perfect argon-filled wire bonds without the need for manual adjustment. The platform's repeatability accuracy is 0.001mm. The unique design of ESEC 3088I P integrates precision control systems that provide a range of features that allow it to quickly bond multiple wire sizes and configurations effectively. These include a high speed wire indexer and automatic bond force compensation, which allow for quick adjustments to optimize the wire characteristics for each bond. 3088 IP also features automated thermal control and cooling systems, designed to ensure efficient and repeatable wire bonds in both high-volume and high-temperature production environments. Its integrated PID temperature and airflow control allow it to vary the temperatures of the heating elements and its ports during each bonding cycle, resulting in consistent and reliable results. 3088iP's flexibility and adjustable parameters also extend to its overall design. It can be configured with either a single-wire, two-wire, or three-wire bonding head to meet the most demanding production requirements. Additionally, it supports a wide range of wire sizes and types, including gold, aluminium and nickel wire. ESEC 3088 IP is the ideal choice for high-volume production of component chips and interconnects. Its combination of features, flexibility, and reliability makes it an ideal solution for companies seeking an automated wire bonding platform with superior performance and superior results.