Used ESEC 3088iP #9091719 for sale
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ID: 9091719
Vintage: 2001
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5μm (3 sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300° C
Pre-bond / post-bond zone: 50 to 300° C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227mm / 8.93"
Width (adjustable): 120mm / 4.72" to 260mm / 10.23"
2001 vintage.
ESEC 3088iP is a precision bonder that offers an efficient and reliable bonding solution for the electronics industry. This equipment is designed to bond surface mount components like TABs and trim terraces, as well as large or small components like BGA and flip chips. ESEC 3088I P features a highly accurate vision system and a reliable, powerful, and capable bond head. It utilizes a direct drive actuator for precise location and positioning of components, making it ideal for high speed applications. The high precision vision unit ensures an accurate viewing area and provides clear images while the high-powered smart-speed control yields a smooth bond process. 3088 IP has an advanced digital imaging technique for precise component placement, along with a new dual-color headlight that provides a high degree of accuracy. The dual-color headlight also ensures that the operator can easily identify components and make sure that they are correctly bonded. Furthermore, the machine has a strategy technique for automatically recognizing components that cannot be identified by the vision tool. The bonder also features an optical test feature, which helps to rapidly identify a defective component. It is equipped with an easy-to-use LCD touch screen for easy operation and convenience, allowing operators to quickly and easily set up the asset for different application conditions. In addition, 3088iP is equipped with various advanced safety functions to protect the operator and the model from accidental damage, such as a lock-out feature that disables the equipment from being operated if there is any danger or potential danger for the operator. Overall, 3088I P is an ideal bonding solution for numerous electronics applications. Its speed, accuracy, reliability and safety functions make it the perfect choice for handling complex tasks in a range of electronics tasks. This bonder is ideal for both manual and automated processes, making it a very versatile device.
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