Used ESEC 3088iP #9091729 for sale
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ID: 9091729
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (Adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is a high-quality wire bonder that is designed to meet the needs of a variety of applications. It has been specifically created to provide superior performance, reliability and longevity. The machine uses a High Frequency ultrasonic bonding technology to achieve maximum efficiency and detailed precision when bonding small-sized wires. It has an integrated programming feature that allows for easy and quick programming for different wire bonding configurations. ESEC 3088I P is a highly precise and customizable device. It has an integrated Computer Numeric Control (CNC) system which allows for accurate and repeatable wire bonding. It has a wide range of integrated software tools which enable users to quickly and easily create programs for different configurations. Its intuitive graphical user interface makes programming and operation simple and comfortable. 3088 IP uses a Hybrid Heat Tool technology which provides low temperature bonding and a higher bonding rate. It also has an advanced Ultrasound Welding System which has the capacity to perform a variety of applications in a wide range of materials. It has a high-resolution Digital Image Processing System which can accurately position the wires and components to be bonded. 3088iP has a durable and reliable construction, making it ideal for industrial use. It is designed with a low vibration and low noise operation, making it suitable for most industrial environments. Its modular design allows for flexibility and enhanced operational performance. The device is capable of operating with a range of input power sources, making it compatible with a variety of industrial applications. 3088I P is an ideal choice for a variety of products and applications requiring superior performance and longevity. Its advanced technology and features, combined with a reliable and versatile design, make it an ideal choice for the most demanding wire bonding projects.
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