Used ESEC 3088iP #9091777 for sale
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ID: 9091777
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227mm / 8.93"
Width (adjustable): 120mm / 4.72" to 260mm / 10.23"
2002 vintage.
ESEC 3088iP is a state-of-the-art wirebonder designed to meet the needs of electronic assembly and production markets. It's a full-featured, advanced, desktop-based equipment that provides automated ultrasonic bonding capabilities. ESEC 3088I P features high-speed precision wirefeed controls, several power settings, a Continuous Cycle Mode, and a Reflare™ mode that allows for easy rework with perfect ball-size forms. 3088 IP has a compact footprint and a full-color LCD display, making it easy to operate and making it suitable for small or medium scale production runs. It is equipped with an intuitive "Easy-Bonding" user interface for optimal user flexibility. The user-friendly design allows for quick setup, fast learning curves, and easy troubleshooting. The system also includes a built-in email notification unit for keeping users informed of any operational status changes in the bonded assemblies. 3088I P is equipped with several unique tooling and construction features. The integrated process capability includes annular ring angular bond capabilities that allow for the reliable assembly of components from 0.5mm pitch and below. It also features a tooling machine which includes a workpiece holding fixture, tweezers, and wire guides. The easy-to-use tooling tool enables faster setup and superior production yields. ESEC 3088 IP is composed of a robust aluminum chassis and includes a variety of innovative cooling systems that help to minimize heat generation during operation. The unit also boasts advanced assembly diagnostics which help ensure accurate and consistent operation. An additional feature is the inclusion of an integrated automated ultrasonic microtia engine, which enables users to quickly and accurately test finished components. 3088iP is designed with user safety in mind. The asset is enclosed in a Kevlar housing that provides superior protection from liquids or machine shock. It also includes an emergency shutoff switch which can be used to immediately stop the machine in the event of an emergency. ESEC 3088iP is an ideal choice for any production environment requiring fast and efficient wire bonding. Its advanced features and exceptional safety characteristics make it an ideal choice for any electronic assembly and production market. The machine is both affordable and dependable, guaranteeing consistently high-quality results.
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