Used ESEC 3088iP #9091776 for sale
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ID: 9091776
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227mm / 8.93"
Width (adjustable): 120mm / 4.72" to 260mm / 10.23"
2003 vintage.
ESEC 3088iP is a compact die bonder that offers high precision and reliability for application in electronic assembly and semiconductor packaging. Featuring a novel vision-guided equipment and servo-controlled motorized stages, this bonder has a wide range of capabilities such as die to die bond, pad to die bond, direct die wire bonding and wire-to-wire bonds. The self-contained unit requires minimal set-up time, no external gas or cooling supply, and is ideal for use in industrial environments. ESEC 3088I P features a 10x optical zoom imaging system with a 10 micron 3-axis resolution for precise alignment of bond sites across a range of applications. The unit also features a closed-loop servo-stepping platform, which allows for accurate movements in all directions including up/down, left/right and angular orientation. This is further aided by an integrated vision machine which can recognize various substrates and align bond sites with sub-micron accuracy. The bonder also has an array of advanced control options, including contact-free friction weld and hot bar bonding, that can accommodate a variety of bonding materials such as gold, copper, and aluminum. With the ability to wire ranging from 34 AWG to 11 AWG, the bonder can handle a large range of substrates and sizes of wire. In addition, its high-speed bond cycle can wire up to 200 bonds per second with a force range of 0-5,000 gm. 3088 IP is also easy to operate and maintain with low cost of ownership due to its user-friendly graphical user interface, low maintenance requirements and long-term reliability. 3088I P bonder is a versatile and reliable device that ensures precise bond alignment and quality production. Its compact size and robust performance makes it ideal for both small and medium-scale applications. With a wide range of control options and capabilities, this bonder is an excellent choice for any production line.
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