Used ESEC 3088iP #9091758 for sale
URL successfully copied!
Tap to zoom
ID: 9091758
Vintage: 2003
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter: 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms / finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (Adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2003 vintage.
ESEC 3088iP is a precision wire and chip bonder that specializes in interconnecting electronic components with leads, wires, or ribbon cables for increased output and performance. The system offers accurate die attach and wire bonding capabilities for a range of applications, making it an ideal choice for many industries. It features an advanced, self-contained bonder head that allows complete control over wire management and placement. It offers variable bond placement options, which allow for wider application range and increased accuracy. ESEC 3088I P features two bonding tools which can be used singularly or in tandem for greater flexibility. These tools include a fine-pitch bonding tool and a wedge bonding tool. The wedge bonding tool can be configured to achieve greater accuracy and to produce a larger bond area for larger components. The fine-pitch tool is designed to provide an even finer pitch result, allowing it to bond smaller components with greater accuracy. The system also offers a bonder head measuring plate system, which provides the accuracy required for demanding applications. 3088 IP can be operated in a variety of different modes to best suit the application requirements. These modes include semi-automatic, full automatic, and manual mode. The semi-automatic mode allows the operator to quickly select and alter bond parameters and features a touch-screen LCD for greater ease of operation. The full automatic mode removes the need for graphical representations of operating parameters and allows the operator to control the process from start to finish. The manual mode provides the highest degree of control over the bonding procedure and permits the operator to fine-tune the settings for the optimum performance. ESEC 3088 IP features a choice of three different heaters for a range of temperature profiles, including a base heater, a chip heater, and an anneal heater. It also includes a Cooling Foot for reducing the temperature of the bonding point quickly. Its advanced bonding software incorporates a variety of advanced features, including multi-point bonding, dynamic delay, and line-by-line bonding, and also offers full programmable control over bonder parameters. In addition to its advanced features, 3088I P is easily upgradable, making it ideal for expanding production lines or upgrading existing equipment. It also includes a highly durable construction with an advanced load cell and a unique open loop thermal stability that maintains constant bond parameters during production. 3088iP can be tailored to meet any customer's individual needs, making it a great choice for any production line.
There are no reviews yet