Used ESEC 3088iP #9091782 for sale
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ID: 9091782
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8 / 24/ 44 mm 0.31 / 0.95 / 1.73"
Pre / post-bond heater plates standard widths: 8 / 25 / 45 / 69 mm 0.31 / 0.98 /1.77 / 2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Lead frame alignment single mode: 10 ms
Finger alignment: ≤ 6 ms / finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is an advanced wire bonder clinically developed, manufactured and serviced by Electro Scientific Industries (ESI) for use in industrial and high-reliability electronics. This fully automated ball and wedge bonder offers the highest performance and highest reliability in its class, with extremely low cycle times for maximum productivity. ESEC 3088I P is designed to execute a variety of pad, wire and stud attachments. It offers a wide range of wire looping shapes and sizes, including large (12.7mm) loops, small (2.7mm) loops, closed loops, and irregular shapes. It also supports single-wire or multiple-wire bonding to achieve the highest process-oriented productivity. This bonder uses proprietary advanced features such as fast-laser-pulse-control and digital pattern recognition to assure positional accuracy, tight bond angles and optimum wire bond placement and quality on every connection. 3088 IP is flexible enough to accommodate different types of device packages using an integrated vision system, automated head positioning, and wafer stage calibration. It features a large depth-of-field and focus-lock capability, enabling the vision system to inspect all wires and bond points on a single wafer. The bonder is also equipped with a proprietary algorithm that enables the detection and correction of off-center accelerations errors for maximum bonding accuracies. In terms of safety and reliability, 3088I P is equipped with a number of advanced features, including a fast inner loop control for precise wire loop control and a patented automatic edge-following system for tight, uniform wire loop profiles. In addition, the bonder is designed to handle a wide range of environmental conditions and diverse applications by providing enhanced shock and vibration resistance, as well as automatic temperature control and humidity monitoring. ESEC 3088 IP is feature-rich and provides high performance and reliability for a range of users. The bonder could deliver superior reliability by ensuring highest accuracy of the bond process and reducing the cycle time. This, coupled with its automated functions, make it an ideal choice for high-volume production applications.
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