Used ESEC 3088iP #9091763 for sale
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ID: 9091763
Vintage: 2003
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227mm / 8.93"
Width (adjustable): 120mm / 4.72" to 260mm / 10.23"
2003 vintage.
ESEC Model ESEC 3088iP is a state-of-the-art wire-bonder designed for next-generation applications. This innovative design features a pristine, four-independent process-specific, open configuration bond head which can be controlled remotely and provide precise wire-bond manipulations. ESEC 3088I P provides dependable 15, 25, 50 and 100 KHz process frequencies to produce vigorous, repeatable results with improved pitch control. The dual-bonding head design allows the user to configure the head to accommodate the application need, with a tape feed option available for attachment of components like IC devices; creating a completely sealed area for bonding processes. For higher precision, 3088 IP utilizes two high-definition cameras with optical zoom to view and record high-resolution videos. This feature allows the user to manually or digitally adjust the bond arching and length while the camera provides the ability to monitor the quality of the bond. In addition, the bonder is capable of programming in multiple bonding parameters in order to customize the arching profile, pitch, and speed requirements. ESEC 3088 IP ensures highly accurate bond formation due to its closed-loop feedback tooling. This feature constantly monitors the bonding process and makes adjustments to keep things in spec. With multiple auto-height sensing capabilities, the bonder additionally ensures that the proper pressure and alignment of the tool is maintained throughout the process. 3088iP comes with flexible programming and expanded user capability. The bonder's user-friendly graphical interface allows for great functionality as it aces any demanding application. This capability allows users to save parameters, settings, and recipes, allowing them to quickly adjust existing programs rather than creating new ones. Overall, ESEC Model 3088I P provides a powerful, automated solution for advanced wire-bonding applications. Revolutionary closed-loop feedback and multiple imaging capabilities ensure precise and repeatable results which make this bonder ideal for high-precision, high-volume production of electronic components.
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