Used ESEC 3088iP #9091752 for sale
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ID: 9091752
Vintage: 2003
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter: 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (Adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2003 vintage.
ESEC 3088iP is a precision displacement bonder designed for ultra-high precision bonding and handling applications. This machine features a highly configurable and reliable automated equipment for the placement and maintenance of small mechanical parts and components. With its high speed and accuracy, it is ideal for use in the production of high-tech precision electronic devices such as micro-LEDs, multi-layer flex-circuits and semiconductor chips. ESEC 3088I P has a wide range of graphical user inputs and outputs for programming and controlling the machine. It includes an E-Stop (Emergency Stop) button, an LCD display that shows the machine's status and error messages, and a built-in touch pad for manual control. With its intuitive user interface, the user can program and monitor the EP3088iP with a minimum of effort. The core of the EP3088iP is its dual-axis positioning system, which consists of a servo motor, precision servo drive, and optical encoders. This unit provides precision motion control of the machine, with a minimum of 0.01mm. A digital auto-focus machine monitors the position of the part and adjusts its position accordingly, in order to achieve the highest levels of accuracy and reliability. To guarantee the best performance, 3088 IP is equipped with a multi-zone thermal controlled zone heating tool. This feature ensures that the perfect temperature is maintained at all times during the bonding cycle, in order to provide an optimal adhesion strength for the bonding of different components. ESEC 3088 IP is also equipped with a variety of sensors and testing systems. These include a temperature sensor that monitors and adjusts the internal temperature, a light leakage detector for monitoring light emission from the parts, and a vibrational monitor to measure and analyze the accuracy of the bond. In addition, a gas-purge asset is available to ensure that all processes have the clean environment necessary for precision bonding. Finally, for maximum performance, 3088I P is equipped with a proprietary automatic calibration model. This allows for quick and reliable calibration of the machine, ensuring safe operation and precise bonding for all parts and components.
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