Used ESEC 3088iP #9091781 for sale
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ID: 9091781
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227mm / 8.93"
Width (adjustable): 120mm / 4.72" to 260mm / 10.23"
2002 vintage.
ESEC 3088iP is an advanced semi-automatic bonder developed by ESEC Inc. for automated interconnect assembly. This bonder is capable of inserting pins, press-fitting terminals, and surface mount components to high-density circuitry and can be used in the production of a variety of components. ESEC 3088I P's precise servo-controlled multi-axis motion equipment allows it to quickly and accurately complete intricate assembly operations that would be difficult for an operator to perform manually. The dual precision linear bearing system decreases vibration while providing stability and accuracy for each process, resulting in greater reliability and fewer rework operations. For pin insertion, 3088 IP can be loaded with either straight or angled pins for an equally precise fit into any substrate. A shockless home position ensures that the pins remain firmly seated in the substrate even during the insertion process. Pressure-sensitive strain gauges are used to monitor force throughout the insertion process to guarantee a reliable and accurate connection. Fanuc motor drivers are used to accurately control the speed and force of the pin insertion to reduce the possibility of substrate damage and to ensure a strong connection. For press-fitting terminals, ESEC 3088 IP can accommodate a wide range of different terminal shapes and sizes. Force sensors are applied to the workpiece during the operation to ensure a uniform and secure terminal fit. Synergistic force control eliminates the possibility of excess strain on the components. An integrated alignment unit ensures that terminals are accurately set in place before the press-fitting process is initiated. The surface mount component placement machine of 3088iP can accommodate board sizes up to 12" x 24" and components up to 7.5mm tall. It uses a four-axis multi-zone placement head and vacuum head equipment driven by a FANUC motor. This provides exceptionally accurate and repeatable placement of components without reducing overall tool speed. An integrated vision asset is used to accurately confirm component placement and reduce misplacement. Overall, 3088I P is a reliable and accurate bonder, capable of performing a wide variety of interconnection tasks. Its high-precision servo motors and careful force control enable ESEC 3088iP to quickly and reliably complete interconnect assembly operations in a variety of settings.
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