Used ESEC 3088iP #9218454 for sale

ESEC 3088iP is an industry-leading high-power precision ultrasonic bonded hermetic sealer from ESEC, utilized in the production of a wide variety of high-end MEMS and other specialized components. ESEC 3088I P utilizes ESEC patented ultrasonic bond technology to achieve unprecedented levels of sealing and durability, offering solutions to challenging hermetic seal applications and enabling the fabrication of components with reproducibly tight environmental seals. 3088 IP is designed to ensure that delicate components and thin-film structures are not damaged or disrupted during the bonding process, guaranteeing the highest degree of process repeatability and reliability. 3088iP features several groundbreaking design features, which ensure unmatched sealing performance at a fraction of the size and weight of other professional bonders. Specifically, 3088I P features a programmable multi-axis automated motion platform that can move up to 200mm on both the X and Y axes. This advanced motion system provides unprecedented precision and accuracy for features such as component positioning, spacing, and nozzle trajectory. Furthermore, a built-in vision system accurately monitors and inspects each bond point and provides feedbacks to make adjustments in real-time for unmatched process repeatability and flexibility. Equipped with a state-of-the-art power delivery system, ESEC 3088 IP is able to deliver up to 12 Watts of ultrasonic power across a wide-range of frequencies and waveforms. This advanced feature ensures that component's and material's delicate structures remain undamaged while simultaneously enabling unprecedented bonding and sealing results. ESEC 3088iP is capable of creating a wide array of hermetic seals thanks to its integrated high-speed thermal transfer pen, capable of delivering up to 400 thermal cycles per second. Additionally, its explosive bonding technology ensures the highest degree of seal integrity and environmental protection. ESEC 3088I P also features an intuitive interface and integrated safety features for maximum user safety. Its ergonomic design further reduces user fatigue and makes it one of the most comfortable high-power bonders to work with. 3088 IP is the ideal bonder for the fabrication of high-end MEMS and other specialized components. With its advanced motion platform and robust power delivery capabilities, 3088iP is capable of creating unparalleled levels of hermetic seals with unmatched precision.