Used ESEC 3088iP #9091740 for sale
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ID: 9091740
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is a high performance wirebonder designed for precision and flexibility. This wirebonder comes equipped with an advanced X-Y motion station, a wide range of ball and wedge bonding capabilities, and a user-friendly touchscreen interface. The X-Y motion station provides an exceptionally high level of accuracy and speed, enabling the user to work on complex projects with precision. The machine's two-axis travel range of 4x2 inches allows for precise application of wires to both larger and smaller boards. This feature also helps to minimize the need for additional labor and equipment for intricate projects. ESEC 3088I P is capable of both ball and wedge bonding on boards. Ball bonding is an automated, high-speed process for attaching wires to a printed circuit board that involves bonding and soldering the wires together to form a continuous connection. Wedge bonding is also an automated process, but rather than welding to the board it relies on a wedge mechanism to attach wires to components with a single connection. This feature eliminates the need for multiple bonds and in turn saves time. In addition, 3088 IP features an ergonomic touchscreen interface making it easy to program and use. From the main menu, users can quickly select wire bonding parameters, monitor machine status, and troubleshoot for errors. This intuitive, user-friendly design eliminates the need for special knowledge about the machine's operation and allows anyone to quickly get up to speed in order to complete projects quickly and properly. Overall, ESEC 3088 IP is an advanced, efficient, and reliable wirebonder designed for both precision and flexibility. Its X-Y motion station, ball and wedge bonding capabilities, and user-friendly touchscreen interface make it an optimal tool for any wirebonding requirement. It is suitable for a wide variety of applications, from small test runs to large, complex projects, making it an ideal machine for any electronics production line.
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