Used ESEC 3088iP #9268315 for sale

ESEC 3088iP is a bonder designed specifically for microelectronic and optoelectronic applications. It is a reliable, high efficiency bonder capable of achieving excellent quality results, which makes it ideal for microelectronic and optoelectronic processes. The bonder is designed with a robust chamber to ensure a reliable environment for the bonding process, as well as a highly accurate heating system which can be set to any temperature across a wide range. It also features a patented oscillation waveform for excellent consistency and uniformity in the bond strength of all the parts being bonded. The bonder is also equipped with a state-of-the-art control system which allows for precise control of the process parameters such as temperature, pressure, duration, and power. The control system is also user friendly, allowing for easy operation and setup. ESEC 3088I P offers up to six bond head positions with interchangeable tooling, allowing the user to easily set up a variety of conduction and wedge bonds. The tooling and its setup provides numerous options for bond sizes and applications. 3088 IP also features built-in infrared cameras, spectral diffusion hot cold box, and a mass flow contour assembly for increased accuracy and precision. The mass flow contour assembly ensures that the force and flow of the heated materials is consistent and uniform. Overall, 3088iP is a reliable and user friendly bonder with technologically advanced features that ensure excellent quality results. It is well suited for microelectronic and optoelectronic applications, providing users with the necessary tools to create high quality bonds quickly and efficiently.