Used ESEC 3088iP #9091754 for sale
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ID: 9091754
Vintage: 2003
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227mm / 8.93"
Width (adjustable): 120mm / 4.72" to 260mm / 10.23"
2003 vintage.
ESEC 3088iP is a high-performance bonder for semi-automated soldering, bonding, and sealing processes. This bonder combines power control, metrology tracking, and positioning accuracy enabling reliable microelectronics assembly. It is a user-friendly, robust and reliable 4-axis bonder designed to be the workhorse of the production floor. ESEC 3088I P features a 20-micron spatial shot accuracy, enabling precise assembly of both fine-pitch and low-profile components. The bonder is powered by a servo-motor driven XYZ motion equipment and a DC servo motor with a maximum location speed of up to 3 m/sec and with 0.1-micron repeatability. It has a thermal imaging vertical measurement system for fast, precise and repeatable positioning of parts and components. The measurement unit also has a wide range of height measurements, including detection of the solder reflow process. The bonder also has a digital feeder machine which is capable of holding up to 12 feeders with a very short cycle time. 3088 IP also features an advanced vision tool, which enables alignment of components to be pinpoint accurate. It combines a laser unit with a positioning asset to ensure the optimal positioning of complex components. The vision model also allows for defect inspection and a correction equipment helps to reduce misalignment errors. It also has a soldering process monitoring system that monitors temperature, force, and waveform during the soldering process. The bonder also has an auto-level unit that ensures the flatness of the PCB before soldering. 3088iP is capable of processing nearly any process allowing users to place a wide variety of components such as BGA, chip on board, flip chip, LCD-bonding, molded packages, through-hole components, connectors, flip-chip, Melf attach, silver epoxies and reflow soldering. Additionally, it has an easily adaptable SPC quality data tracking machine that allows users to quickly and easily track process data. Overall, 3088I P is an ideal bonder for high-performance microelectronics assembly and offers a reliable platform for any soldering, bonding and sealing process. It is designed to be very user-friendly, robust, reliable and accurate. The combination of power control, metrology tracking, and positioning accuracy allows for dependable and repeatable processes.
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