Used ESEC 3088iP #9091751 for sale
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ID: 9091751
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is a powerful, multi-functional bonder system optimized for interconnect and packaging applications. It is designed for the assembly of all types of components, and is a versatile and high-performance machine. Its advanced hardware and software design ensures that users can take advantage of modern production techniques while meeting the high standards necessary for device reliability and volume manufacturing. This machine is the perfect solution for prototyping, assembly, and production of both digital and analog devices. The core component of ESEC 3088I P is its bond head, which can be used for either wire or ribbon bonding. This high-precision bond head has a closed cycle process and features automated process controls for consistent performance. It is also built to handle a wide range of wire diameters, up to 0.005mm or 0.02in. The head is also designed for a wide duty cycle range, allowing for consistent bonding performance. In terms of accuracy, 3088 IP has a precision ranging from 0.1mm to 0.01mm, and is capable of accurately controlling wire tension. Additionally, the control system ensures that wire can be processed quickly and with minimal defects. In terms of safety, the machine has an optical aligner that detects errant wires and interrupt Bond cycle immediately. This ensures that contact between wires is not established until the wires are correctly aligned. Additionally, because the bond head is mounted on an independent motor, no adapter cables are necessary in order to modify the active surface area of the bond head. This helps to reduce the risk of accidental damage to the wires. In terms of ergonomics, the machine features easy-to-use controls and a graphical user interface that makes setup and adjustments quick and simple. Overall, 3088I P is an incredibly reliable and efficient machine. It is designed to meet the demanding needs of interconnect and packaging applications, and offers users the reliable performance and accuracy necessary for high quality parts. With its advanced hardware and software design, this machine is an ideal solution for creating and assembling all types of electronic devices.
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