Used ESEC 3088iP #9091743 for sale
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ID: 9091743
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / Post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (adjustable): 120 mm / 4.72" to 260 mm / 10.23"
2002 vintage.
ESEC 3088iP is a specialized bonding machine designed for automation of precision assembly applications. Utilizing a miniature work head and interchangeable feeders, ESEC 3088I P offers unparalleled flexibility and precise control over the parts engaged during the bonding process. The miniature work head houses a 2-axis robot designed for servo control of each of the parts in the assembly process. The robot is capable of moving each part independently, as well as synchronous movement, which enables faster, more precise bond formation. Furthermore, its flexible design allows for easy integration into existing assembly lines. The metal base of the machine serves as a platform to which a collection of feeders can be mounted, allowing for inventory management of up to sixteen parts per feeder. Additionally, the machine has a vision system, which is capable of recognizing parts. When incorporated into the assembly process, it automatically sorts and supplies the correct parts for each project. The work head also features precise temperature and pressure control, to ensure that the conditions are optimized for each part. The heat application is adjustable, with temperatures ranging from 200°F to 800°F (93°C to 427°C). Moreover, the applied pressure is monitored and adjusted according to the type of material being used. 3088 IP is a robust and versatile bonder. It is suitable for projects of varying sizes, and offers multiple levels of control over the parts. The machine's temperature and pressure control, vision system, flexible design, and interchangeable feeders make ESEC 3088 IP perfect for precise and efficient precision assembly and bonding applications.
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