Used ESEC 3088iP #9091779 for sale
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ID: 9091779
Vintage: 2002
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 Sigma)
Typical sprint UPH: (11) Wires / Second
Max. bonding area: 52 x 64mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300°C
Pre-bond / post-bond zone: 50 to 300°C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: single or multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Max. wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227mm / 8.93"
Width (adjustable): 120mm / 4.72" to 260mm / 10.23"
2002 vintage.
ESEC 3088iP is an automatic wire bonder for quick and accurate interconnecting of components. It is designed to process a wide variety of component types and packages, and provides a fast, reliable and cost-efficient wire bonding process. ESEC 3088I P is built with a 10-inch view display, providing operators with the ability to clearly view operation settings and the wire bonding process while making any necessary adjustments. 3088 IP is capable of processing a wide variety of wire sizes and diameters. The unit is equipped with adjustable wafer chucks and is capable of managing all wire loop styles, including thermosonic ball bonding, wedge bonding, thermocompression bonding, and gold/palladium ball wire bonding. The wire bonder also offers an index turret, facilitating easier wire loop adjustments and process fine-tuning with minimal downtime. 3088iP is engineered for high throughput and accuracy. It is designed with a high-speed motion equipment and automated wire feed system, enabling fast processing times and accurate wire position settings even when working with unconventional loop formation. The wire bonder is designed to reduce material consumption and operator fatigue by combining multiple formation functions into a single layout. The unit also has an automated height adjustment function, allowing operators to quickly change the loop size while maintaining superb accuracy. In addition, 3088I P is designed with an automated clamping unit, which minimizes time wastage while optimizing bond strength. It also has a built-in vision machine to detect curvature, scrap, and ejected wire. This boundary restoration tool is designed to ensure process quality and reduce production costs. The unit also features an effective data backup asset which boosts operator efficiency and eliminates potential process disruptions. ESEC 3088 IP is compliant with industry standards and multiple industry certifications and has an ergonomically designed operating station and user-friendly control model. The versatile machine is designed for simple setup and operation, allowing bonders to quickly ramp up operations and quickly change process parameters with minimal user experience.
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