Used ESEC 3088iP #9025706 for sale
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ID: 9025706
Vintage: 2001
Wire bonder
Flying bondhead:
Bond placement accuracy: ± 3.5 μm (3 sigma)
Typical sprint UPH: (11) Wires / Second
Maximum bonding area: 52 x 64 mm / 2 x 2.5"
Indexer:
Process zone temperature: 50 to 300° C
Pre-bond / Post-bond zone: 50 to 300° C
Process heater adapter blocks standard widths: 8/24/44 mm 0.31/0.95/1.73"
Pre / Post-bond heater plates standard widths: 8/25/45/69 mm 0.31/0.98/1.77/2.72"
Wire:
Spool diameter: 50.8 mm / 2"
Spool width: 25.4 to 50.8 mm / 1 to 2"
Windings: Single / Multi layer
Gold wire diameter:
Standard: 17.5 to 50 μm / 0.7 to 2.0 mils
Capillary:
Length: 11.1 mm / 0.437"
Diameter 1.58 mm / 1/16"
PRS System:
Chip alignment:
Std. mode: 10 ms
Adv. mode: 30 ms
Leadframe alignment single mode: 10 ms
Finger alignment: ≤ 6 ms/ finger (304 ld)
Looping:
Flat loop: 125 to 250 μm < 8 μm, 5 to 10 mils < 0.3 mils
Standard loop: 125 to 200 μm < 8 μm, 5 to 8 mils < 0.3 mils
Typical data TSOP:
Wire length: 2 - 3 mm (140 μm 6 μm)
Typical data QFP:
Wire length: 3 - 4 mm (200 μm 8 μm)
Maximum wire length: 7 mm / 280 mils
Wire straightness: < 1% of wire length
Magazine handling:
Magazine gripper with self-adjusting clamps
Buffer capacity magazine platform:
(4) Magazines for QFP 84 L/F
Loading / Unloading platform dimensions:
Depth: 227 mm / 8.93"
Width (Adjustable): 120 mm / 4.72" to 260 mm / 10.23"
Spare parts missing
2001 vintage.
ESEC 3088iP is a precision thermosonic bonder manufactured by ESEC that can be easily integrated into assembly lines and processes. This bonder is designed to meet high-volume requirements with its advanced automated process control technology. The bonder has a robust, solid structural frame with high accuracy manual aligners for accurate and repeatable bonding. The bonder is particularly designed to deal with flip chip and solder ball connections that require a high precision and accuracy. ESEC 3088I P is equipped with ultra-accurate force control to ensure precision placement and bonding. This bonder also comes with a wide variety of piezo-electric transducers and acoustic horns to ensure optimal acoustic energy distribution. It also has an integrated precision multi-axis CNC motion controller for high speed processes and precise positioning of the parts. This bonder also comes with an in-house designed and integrated vision equipment to ensure precise orientation and placement of parts. The bonder is equipped with an advanced and advanced controlling system to automate and monitor the process. It has a powerful programmable logic controller (PLC) that allows for flexibility in the control circuit. This bonder has a standard graphical process editor that helps to set up parameters of each step to optimize the performance. The bonder also has an error detection and correction capability that can help to find errors and correct them before starting the actual bonding process. 3088 IP also has an interface for different industry communication protocols. This interface allows easy integration with other manufacturing systems, allowing for real-time communication and data transfer. The interface is highly used for diagnostics, configuration, quality control, and machine monitoring. The bonder has an accurate real-time temperature monitoring unit and a specialized feeder machine to make sure the pieces are heated to the correct temperature. The bonder has a powerful monitoring tool for exact control of the temperature. A dynamic alarm asset allows the user to get updates on temperature variations, overheating, and incidences that could cause damage. 3088I P is a reliable, user-friendly, and precise bonder. It is ideal for companies who require precise and repeatable high-volume automated processes. By integrating the bonder into existing processes and workflow, this device offers a highly effective solution to bond various electronic components with precision.
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