Used ESEC 3088iP #9151108 for sale

ESEC 3088iP is a state-of-the-art advanced full-fledged epoxy die bonder that offers high-end automation and accurate die placement technologies. This modular bonder is designed to fulfill the industry requirements of full-size die into different package types in today's high-tech manufacturing processes. Its reliable design consists of high-performance modules for the bonding process, including die transfer, die attach, die alignment, wirebonding, and interposer fixation. ESEC 3088I P features a high-precision, eight-axis, all-digital motion control equipment, providing tight control of all positioning and alignment movements. The die bonder's accuracy is maintained at all times with its advanced CCD camera and metrology-grade stages. Additionally, the system has integrated full 9-axis vibration/tilt compensation unit for the highest precision placement. This makes the bonder capable of delivering a 0.1-micron repeatability for both die placement and receptacle alignment. 3088 IP offers a wide range of flexible and high-productivity solutions for die attach. High-efficiency, non-contact, and hyper-speed transfer are enabled by its advanced actuators and vacuum systems. This bonder also has a dual-head configuration, enabling two independent process steps in parallel, which helps to improve die bonding throughput. Moreover, the bonder comes with an onboard calibration machine and a manual setup station, making it possible to reconfigure the tool quickly and safely. This capability allows for different tool setups for different applications. The asset also has a built-in Recipe Management Model, which helps to optimize throughput and reduce cycle time. Overall, 3088iP is an advanced, highly accurate die bonder designed to meet the needs of today's demanding semiconductor industries. As such, it is a reliable, highly cost-effective, and efficient solution for die attach in all types of semiconductor packaging applications.