Used ESEC 3088iP #9248624 for sale

ESEC 3088iP is an automated die attach bonder used for die and component attachment. It is an efficient and cost-effective way to attach components in all kinds of electronic assemblies. The machine is a versatile, two-position inline equipment with an integrated vision system, automatic ejector, gripper and twin bond heads. With its sophisticated design, it can be used in various sectors such as consumer electronics, automotive, and medical components. ESEC 3088I P is designed to optimize the accuracy and speed of attach processes. The vision unit and robot can easily identify various types of dies, parts, connectors, and heat sink brackets, with repeatable precision. The double head station works together with a feedback machine and automated elbow operation to manage the process, ensuring high precision results. The robotic arm and the vision tool also help to easily align, place oxide-free pick-ups, and ensure that the die and substrate are correctly joined. The machine can bond a wide variety of material including Silver, Gold, Copper, and Aluminum in all sizes and thicknesses. The bond parameters are programmable and allow for precise synchronization of the head and elbow movements. The dual bond heads can be quickly programmed for different applications while the control asset ensures that the parameters are maintained during operation. 3088 IP has an advanced heating model to ensure precise temperatures during the process. The bonding oven has a hot stage controller and temperature feedback to accurately control the heating and cooling process. The automatic feeding equipment can accommodate multiple different formats of feeders, including tape-on-reel, waffle packs, stick-on-reel, tray-on-reel and turret feeders. In summary, 3088iP is an advanced die attach bonder with precise temperature management, automated vision alignment, and dual head station. Its sophisticated design, Twin Bond approach and its pick & place technology creates a highly efficient process that can accommodate a variety of die sizes, substrates, and feeders. It is an ideal choice for industrial processes that require precision joining of components.