Used ESEC 3088iP #9249894 for sale

ESEC 3088iP is a high performance bonding equipment designed to provide fast and reliable bump, chip, and package interconnects for a variety of applications. It is ideal for applications including chip and package bonding, electrical interconnects, and advanced wire bonding. The system uses a professionally-trained operator-assisted bonding process with automated features for speed and accuracy. Its advanced features are able to accommodate a full range of materials, including gold, thin gold, aluminum, copper, and silver. It also offers a broad range of programmable parameter settings to customize wire and bump bonds for your specific application. The unit is designed with a very small footprint, making it suitable even for tight spaces. ESEC 3088I P offers high speed, high accuracy bonding. It utilizes a precision servo positioning machine that can move with 0.001 mm resolution in six degrees of freedom to achieve precise alignment. The tool also features high speed, high resolution thermal infrared imaging, allowing it to accurately monitor and adjust the bonding process to ensure a proper bond. It can also process wires ranging in diameter from 0.1 to 2.2 mm with a stroke speed of up to 22 cm/s. The asset is also equipped with a comprehensive fault detection model. This equipment provides users with clear and accurate warnings when faults are detected, ensuring that the bond process is successful. 3088 IP is also programmed with advanced intelligence that helps to reduce operator errors, giving users more control over the bond formation process. 3088iP is designed to be extremely reliable and to perform consistently even in harsh environments. It is supplied with a suite of tools designed to help optimize the bonding process, minimizing the need for manual alignment and calibration. With its specialized technology and reliable performance, ESEC 3088 IP is the ideal solution for a number of applications.