Used ESEC 3088iP #9263934 for sale

ESEC 3088iP is an advanced automatic bonder designed for the high accuracy and repeatability needed for wafer-level and chip-level dieattach applications. This advanced equipment features precision XY controls with resolutions up to 0.29 microns, high-force automated dieattach, and powerful process monitoring and control software. ESEC 3088I P is designed for high-volume production of diebonding applications. The automatic bonder is capable of creating up to 160 bonds per hour while guaranteeing a very high yield rate. The system utilizes a unique double-sided application head with two hot-air streams, allowing for precise placement of the die onto a wafer or substrate. Once the die is in position and soldered, the automatic bonder applies a second flux layer and re-flows the connection. This advanced bonder also features a vision-assisted alignment unit that accurately tracks the die's position with the fiducial marks on the substrate before positioning the die. Additionally, 3088 IP is equipped with a vacuum machine to ensure accurate and repeatable die placement.5 3088iP is designed with multiple safety features, including temperature protection and algorithmic process monitoring. The tool also features a reliable fluidics asset that ensures the quality and accuracy of the dieattach process. This bonder includes full traceability of each step of the bonding process, enabling accurate process control and tracking. 3088I P combines precision mechanics, advanced software, and powerful capabilities to create a reliable and fast dieattach bonder. This easy-to-use model is ideal for dieattach applications requiring high accuracy and repeatability. It is one of the leading solutions in the industry for reliable, efficient, and cost-effective wafer-level and chip-level dieattach.