Used SHINKAWA UTC-1000 #293615201 for sale

SHINKAWA UTC-1000 is a high-technology wire bonding equipment with advanced features suitable for a wide range of applications. The system is specifically designed for fine pitch and large pitch wire bond applications, and provides high accuracy bonding results. At the heart of the unit is a combination of a high-speed and high accuracy XY robot, capable of working within a wide range of bonds, from fine pitch and high-speed wire bonds to long bonds. Additionally, SHINKAWA UTC1000 features an intuitive and user-friendly programming interface which provides quick and easy access to all the available features. The machine is equipped with an advanced vision tool, capable of detecting and locating various features on the bonding substrate, such as contacts and through-holes. This vision asset allows for improved accuracy by compensating for substrate misalignments or bond size variations. Additionally, the model is capable of providing feedback about the bond quality, including force and ball pull values, allowing for further optimization. The equipment is additionally equipped with a number of advanced process control functions, such as fine pitch and long bond wire feed control, as well as active temperature control of inputs and outputs. Temperature control is essential in order to maintain top quality bonds and to eliminate any potential issues related to wire fatigue or failure due to high-temperature fluctuations. The system is also equipped with an integrated ULPA filter and dedicated software control, allowing it to be used in a cleanroom environment while still maintaining its speed and accuracy. Furthermore, UTC 1000 is designed for easy maintenance, with quick access to all parts and components. In conclusion, UTC-1000 is an advanced wire bonding unit designed for both high speed and high accuracy. Thanks to its intuitive programming interface, temperature control machine and vision tool, it is a perfect choice for a variety of applications.