Used SHINKAWA UTC-1000 for sale
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Popular Product
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
107
Popular Product
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
150
Popular Product
SHINKAWA
UTC-1000
Gold wire bonder Bond area (X / Y): ±28 mm / ±33 mm Loader and unloader missing 2004 vintage.
105
Popular Product
SHINKAWA
UTC-1000
Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm
125
Popular Product
SHINKAWA
UTC-1000
Wire bonders Bonding method: Ultrasonic thermo compression Bonding speed: 67 ms / 2 mm wire (With lo
268
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