Used SHINKAWA UTC-1000 #293634945 for sale

SHINKAWA UTC-1000 is a fully automated, programmable ultrasonic wire bonder designed to reliably bond a wide variety of thermocompression and thermosonic wire bonding applications. It comes equipped with two bond head mechanisms, a bench mounted operator interface and a high speed connection to a large capacity feeder. Its two different bond heads are designed to accommodate both a traditional capilliary as well as a stud-type bond wire attachment system. The capilliary bonder is designed to bond large gauge wires and it is capable of quickly and accurately bonding high mass wires in just a few seconds. The stud-type bonder is suited for the more precise bonding of small gauge wire and operates at speeds of up to 6,000 bonds/hour. SHINKAWA UTC1000 is capable of executing a wide range of wire bonding operations due to its advanced motor control system. It uses an advanced optical machine vision system to detect both the wire and its target for precise placement as well as inspect the quality of the wire connection. Additionally, its thermal controller allows for accurate temperature control of the bonding process to provide ideal bonding strength. The operator interface provides functional control over the entire process. It includes an easy-to-use software interface that allows users to program, monitor and control the bonder operation. The interface also offers an easy access to various settings such as the bonder temperature, bonding head speed, wire feed speed and wire feed direction. Furthermore, the wire bonder provides a real-time display of the actual wire bond position during bonding operations. The bonder is designed to be easily adapted and integrated into fully automated systems. Its large capacity feeder ensures an even and uniform bond wire supply rate. The feeder also has the capability to store and manage up to ten different feeder trays. UTC 1000 is the ideal wire bonder for performing a large variety of wire bonding operations in both high volume production and small-scale custom applications. Its advanced features, such as its bonded wire detection, variable speed bonder and temperature control, make it an ideal choice for the reliable and high quality ultrasonic wire bonding operations.