Used SHINKAWA UTC-1000 #9398792 for sale
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ID: 9398792
Vintage: 2006
Wire bonder
Bonding method: Ultrasonic thermocompression
Machine accuracy: ±2.5 µm (3σ)
Bonding speed: 67 ms / 2 mm wire
Bonding wire length: 8 mm (Maximum)
Wire diameter: Gold wire φ15 µm - φ38 µm
Number of bonding wires: (8000) Wires
Loader / Unloader: Magazine stacker type
Indexer: Center-parting type universal indexer
Compressed air: 500 kPa
Vacuum pressure: 74 kPa
Pattern recognition unit:
Detection method: Gray scale correlation
Detection speed: 0.11 s / 2-point allignment
Detection area:
Lead side (X: ±1.26 mm, Y: ±0.86 mm)
Die side (X: ±0.31 mm, Y: ±0.21 mm)
Bonding area:
X: ±28 mm
Y: ±33 mm
Power supply: 100 VAC±5 %, 50 / 60 Hz
Power consumption: 1000 W
2006 vintage.
SHINKAWA UTC-1000 is an automated wire bonder specialized for manufacturing and repairing electronic components. The machine works by placing the wire bond on a component, then soldering it onto the component. The machine is capable of producing extremely precise bonds, as the bonding process can be specifically tailored to the components being bonded. SHINKAWA UTC1000 provides various functions for accurate wire bonding, such as an autofocus camera for observing the bonding operation, fast and precise bonded wire positioning, and an instruction library for wire bonders. The machine also has an interactive user interface that can be used to view wire bonding parameters in real-time and easily adjust settings as needed. Additionally, the machine is equipped with an advanced wire feeder mechanism that allows it to feed wire at high speed and accuracy, making it ideal for large-scale production. UTC 1000 is highly efficient as it is able to bond several components in a single cycle. Moreover, its integrated process control system ensures that each bond is produced with uniform temperature and force, resulting in consistent and reliable bond results. The robust system also helps to reduce the possibility of errors, significantly increasing production yields. In terms of versatility, UTC1000 is capable of bonding wires ranging from 0.003mm to 1mm in width. The machine is also easy to operate and maintain, making it ideal for a range of production needs. It has a compact design that allows it to fit easily into smaller factory spaces, which allows it to be moved around on the factory floor when necessary. Finally, its built-in safety systems ensure that operators remain protected during operation. These systems include a safety door, emergency shut-off switch, and anti-slip feet that prevent slipping and slipping accidents. This means that users of SHINKAWA UTC 1000 can enjoy peace of mind while using this machine.
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