Used SHINKAWA UTC-1000 #9398795 for sale
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ID: 9398795
Vintage: 2007
Wire bonder
Bonding method: Ultrasonic thermocompression
Machine accuracy: ±2.5 µm (3σ)
Bonding speed: 67 ms / 2 mm wire
Bonding wire length: 8 mm (Maximum)
Wire diameter: Gold wire φ15 µm - φ38 µm
Number of bonding wires: (8000) Wires
Loader / Unloader: Magazine stacker type
Indexer: Center-parting type universal indexer
Compressed air: 500 kPa
Vacuum pressure: 74 kPa
Pattern recognition unit:
Detection method: Gray scale correlation
Detection speed: 0.11 s / 2-point allignment
Detection area:
Lead side (X: ±1.26 mm, Y: ±0.86 mm)
Die side (X: ±0.31 mm, Y: ±0.21 mm)
Bonding area:
X: ±28 mm
Y: ±33 mm
Power supply: 100 VAC±5 %, 50 / 60 Hz
Power consumption: 1000 W
2007 vintage.
SHINKAWA UTC-1000 is an advanced production bonder from SHINKAWA Electric Company that is designed to provide high quality and efficient bonding of electronic components. This bonder is primarily used for crystal bonding, chip bonding, lead frame bonding, and other assembly processes in the electronics industry. SHINKAWA UTC1000 utilizes a direct hot bar equipment for forming bonds by heating a metal element, known as a bond finger, that is placed against the circuit board or components. Heat is then applied at thee prescribed temperature and time, and then the bond finger is depressed against the components to form the bond. This process occurs within one second, making it extremely efficient. UTC 1000 has a software controlled process that enables it to accurately control all parameters such as bonding temperatures and forces, as well as allowing the user to customize the process to individual requirements. This ensures that consistently high quality bonds are formed. This bonder has a built-in vision system that uses a CCD camera to detect the quality and location of the bond, as well as enabling proper placement and alignment. SHINKAWA UTC 1000 also includes a microprocessor-based control unit, which ensures precise and repeatable process control. A LCD touch panel is included for data input and process control, as well as troubleshooting. UTC-1000 provides a closed loop machine with a processor controlled bonding speed, allowing it to produce bonds with minimal force and stress. This helps to reduce mechanical loading and protect delicate components. The safety tool of the bonder monitors all electrical and mechanical components and will shut down the asset if any malfunctions occur. The versatile UTC1000 bonder is designed to work with a wide variety of materials and comes with a variety of bonders available. This bonder is robust and can produce high quality and efficient bonds with little difficulty. It is an ideal tool for high volume and complex bonding applications.
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