Used SHINKAWA UTC-1000 #9383142 for sale

Name: SHINKAWA UTC-1000
Brand: SHINKAWA
SKU: 9383142
Availability: InStock

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Bonders

Manufacturer

SHINKAWA

Model

UTC-1000

ID: 9383142

Vintage: 2006

Wire bonders, many available Target material Type: IC, LSI, BGA General lead frame: 0.07 mm - 0.3mm Wide Copper frame: 0.07-0.16 mm Thin substrate: 0.3-0.5 mm Thick substrate: 0.5-0.7 mm Carrier for transportation 1.0 -2.0 mm Wire: Gold wire, Φ 15-38 μm (2" both flange spools) Bonding method: Au wire bonding by THERMOSONIC bonding Bond speed: 67 ms / 2mm wire Wire length: 8 mm (Maximum) Wire bend: Within 50 μm / wire length 4.5 mm Bonding accuracy: ± 2.5 μm (3σ) Load time: 3-150 ms (0.1 ms / Step) Bond load: 30-2940 mN (1 mN / Step) Search speed: 1-80 mm / s (0.1 mm / Step) Bonding position setting: Self-teaching method Roader / Unloader section Magazine size: Width 23-90 mm, length 110-265 mm Movement pitch in each direction: 10 μm / step Transport method: Digital clamp feed method Feed pitch: 71 mm (5 μm / Step) Heat block heating range: Room temperature to 300°C Compressed air: 0.5 MPa, 60 L / min Vacuum: -74 kPa Bond area: X: ± 28 mm, Y: ± 33 mm Power supply: Single phase, 100 VAC, 50/60 Hz 2006 vintage.

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SHINKAWA UTC-1000 is an advanced bonding machine designed to provide excellent bonding and lead-free soldering capabilities. The machine is specifically designed for use with fine pitch components and features a wide range of capabilities including double sided and multi-layer aluminum bonding processes. Its advanced control technology ensures consistent results with easy set up and fine adjustment. SHINKAWA UTC1000 utilizes a high performance parallel motion robot arm that is capable of achieving precise pitch control and cutting process execution times. With this parallel motion robot technology, higher soldering quality is achieved due to the improved repeatability of soldering pattern. Additionally, the machine is fitted with a sophisticated vision system to enable exact location when working with fine-pitch components. The machine is capable of achieving up to 4800 soldering points per hour with a single robot arm, meaning that even the most complex designs will be finished accurately and quickly. Furthermore, UTC 1000 is fitted with a Compal Advanced Solder Paste Jet System (ASPJS) which makes the process of flux and solder paste application easy and precise. This ensures fast and accurate manning of fine pitch components. SHINKAWA UTC 1000 is also equipped with an advanced imaging system for viewing soldering processes during operation. By providing visual feedback, errors can be quickly identified and corrected resulting in higher quality results. Additionally, the machine is also equipped with an intuitive touch-screen control panel for easy operation. Overall, UTC1000 is a highly advanced and precise machine that provides great bonding and soldering capabilities. It is easy to operate and capable of achieving highly accurate results in a shorter amount of time. Its advanced control sytems and robotics make it easy to keep up with today's ever-increasing demand for faster production times and higher quality work.