Used SHINKAWA UTC-1000 #293656040 for sale

SHINKAWA UTC-1000 is a high-end bonder designed to automate precision bonding jobs in electronics assembly. It features four highly precise and robust modules that work simultaneously to complete the bonding process. The bonder utilizes a combination of ultrasonic and thermo-compression technology to deliver superior bonding performance. The ultrasonic module is responsible for heating and forming the bond and shapes the bond surface for a perfect fit between the two parts being bonded. The thermo-compression module performs the crimping operation to compress the bonded parts and ensure a complete seal is achieved. The other two modules are used to ensure the bond is strong and secure. SHINKAWA UTC1000 is controlled through an intuitive Windows-based graphical user interface (GUI), allowing for quick and easy programming and operation. All bonding parameters such as exposure time, temperature, current, and pressure can be accessed and adjusted directly from the GUI. With maximum exposure time of 300 seconds, the bonder achieves the longest exposure time of any similar bonder available in the market. Additionally, UTC 1000 supports two Modes - Soft and Hard bonding to ensure maximum bonding strength is achieved. Advanced monitoring and diagnostics capabilities minimize the risk of faulty bonding. Through real-time monitoring, the bonder is able to detect the slightest variation in temperature, power, and pressure. The process data are compiled and saved for analysis and reporting. In addition, the bonder utilizes built-in self-diagnostics check processes to detect, log, and provide error codes when necessary. UTC-1000 is designed with safety and productivity in mind. All bonder elements and components are housed within an ergonomically optimized cabinet for user comfort. The risk of accidental thermal burns is mitigated by an integrated air circulation system. Finally, the bonder also features an innovative component recognition system to speed up the setup process. Overall, UTC1000 is the perfect choice for electronics assembly professionals looking for reliable and precise bonding solutions. Its combination of mission-critical features such as ultrasonic and thermo-compression technology, intuitive GUI, safe design, and advanced monitoring make the bonder the ideal choice to complete precision bonding jobs quickly and without incident.