Used SHINKAWA UTC-1000 #293615202 for sale

SHINKAWA UTC-1000 is a bonder designed for the precise and efficient application of adhesives and sealants to semiconductor devices. The equipment uses precise temperature and pressure control, as well as an inert atmosphere chamber for a precise and automated solution for semiconductor assembly. The device is automatic and offers precise control of temperature, pressure and speed settings that can be adjusted based on the specific needs and applications of the workpiece. The device has a maximum pressure of 1,000KPa and a maximum temperature of 350°C, with a speed range between 0.5mm/s and 10mm/s. The system has a baking oven that is designed to bake the adhesive prior to application. SHINKAWA UTC1000 features a user-friendly interface and software programs that can be used with various operating systems. The bonder can be configured to allow different operator settings, which can be customized for particular tasks or applications. The operator settings are stored on a ROM chip, which greatly improves operability and efficiency. The device also comes equipped with a range of components, such as a power feeder, drive shafts, auto-clamping mechanism and heating element for precise application of adhesives and sealants. The unit also has a six-axis manipulator for precise placement of the components. UTC 1000 is capable of bonding adhesives and sealants to a variety of substrates and materials, including ceramics, plastic, metal, glass and other materials. Additionally, the machine is designed to meet various safety standards, such as RoHS and CE. UTC-1000 is a versatile, precise and efficient bonder designed to meet the needs of various semiconductor assembly operations. The tool offers an array of features and components to ensure consistent, accurate and safe assembly of components, allowing for a streamlined and efficient production process.