Used SHINKAWA UTC-1000 #293656041 for sale

Manufacturer
SHINKAWA
Model
UTC-1000
ID: 293656041
Vintage: 2005
Wire bonder 2005 vintage.
SHINKAWA UTC-1000 is a fully automated, multi-functional wire bonder designed specifically to meet the production needs of the electronics industry. This state-of-the-art equipment has been designed with an innovative automatic wire looping system that facilitates a fast and consistent bonding process. SHINKAWA UTC1000 is equipped with a powerful loop unit that allows users to make up to 100 loops per second, delivering high-speed wire bonding without compromising precision or accuracy. The loop machine features a robust servo control tool, which is capable of precise adjustment of the loop height and close-knit stitch sewing. This ensures that the wire loops are stable, reliable and accurate. The asset also utilizes an advanced vision model that ensures consistent quality and optimal production yields. UTC 1000 also provides a range of advanced features that allow users to customize the parameters of their bonds. These features include a semi-automatic job setup equipment, the ability to program up to 100 jobs, and the capability to store up to 10 jobs and recall them at any time. The system also offers built-in diagnostic functions that helps maintain optimal production yields by providing users with early detection of any issues that may occur during the manufacturing process. UTC1000 also features an intuitive user interface that enables users to quickly make changes to their wire bonding. The interface can be operated via a touch screen or mouse, and allows users to adjust bond length, wire tension, and other parameters. Additionally, the unit comes with a library of pre-programmed standard patterns, allowing users to quickly and accurately apply wire bonding operations for a range of applications. In addition to its advanced capabilities, UTC-1000 also features a number of safety features to minimize the risk of operator error. The machine is equipped with a hand and eye protection tool to protect operators from any fumes or hot solder particles during the manufacturing process, and also contains an automatic lock asset to prevent unintentional activation of the model. Overall, SHINKAWA UTC 1000 is an exceptionally powerful and efficient wire bonding equipment. It provides impeccable accuracy, speed, and reliability, giving users the flexibility they need to quickly and accurately produce wire bonds. The system is easy to use and maintain, making it an excellent choice for the electronic industry.
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