Used SHINKAWA UTC-1000 #9222455 for sale

SHINKAWA UTC-1000 is an advanced ultrasonic bonding machine used to join two materials together through the process of high frequency vibrational energy. The machine consists of three main components: an ultrasonic generator, a bonding horn, and a bond head. The generator produces the high frequency vibrational energy needed to bond the two materials together, typically at 15-50 kHz. The bonding horn then amplifies the signal to high intensity, which is directed toward the bond head where it contacts the materials to be bonded. The bond head then focuses the ultrasonic energy onto the interface between the two materials, which generate a small amount of heat that melts the materials together to create a strong bond. SHINKAWA UTC1000 offers several advantages over traditional joining techniques. Firstly, the machine is capable of bonding materials of varying thickness, ranging from thin plastics to metals, without the need to machine or grind the surfaces. This makes the process more efficient and the bonds stronger. Secondly, ultrasonic bonding generates minimal smoke, heat, or spatter, making it easy to operate in a clean, safe environment. Finally, the process is fast and accurate, allowing it to be used in high-volume operations. UTC 1000 is designed to be easy to use and maintain. The control panel features simple, intuitive operation, and the machine can be quickly and easily serviced with a minimum of special tools. The machine is also compact and lightweight, making it ideal for use in a variety of industrial applications. In conclusion, UTC-1000 is a highly versatile ultrasonic bonding machine suitable for a variety of joining applications. Suitable for use with a wide range of materials, the machine offers significant advantages such as reduced wastage, ease of use, and accuracy. Furthermore, the machine is backed by SHINKAWA excellent customer support and technical service personnel.