Used SHINKAWA UTC-1000 #9164516 for sale

SHINKAWA UTC-1000 is a computer-controlled die bonder that is often used in the electronics industry. This high-speed machine is able to bond components of varying shapes and sizes to a substrate. It utilizes a highly advanced imaging system that helps accurately detect and locate components across the substrate in order to correctly bond them. SHINKAWA UTC1000 uses bond heads that are compatible with a wide range of materials, from lead-free metals to ceramic substrates. This machine also comes with a precision alignment station allowing it to easily and quickly handle both single and multi-chip die bonding jobs. The bond heads can be programmed to allow manual positioning or for high-accuracy semi-automatic control. UTC 1000 also features a photo-optical humidity control system that allows it to maintain balance in its operating environment. UTC1000 is well-suited for use in the production of printed circuit boards, opto-electronics, flip chips, IC assemblies, and other electronic components. This machine has a robust design and is able to accurately bond many types of components. It is equipped with a ten inch LCD display and supports various input and output-related protocols. UTC-1000 also features a built-in memory for easier programing and more efficient operation. SHINKAWA UTC 1000 is also equipped with various advanced safety systems that ensure high quality results while protecting the operator, as well as delicate electronic components. This includes protective covers and guards, automatic shut-off features, and emergency stops. Overall, SHINKAWA UTC-1000 is an excellent solution for the efficient and accurate production of delicate electronic components. It is highly reliable, accurate and easy to use, providing the ideal solution for any die bonding issue.