Used SHINKAWA UTC-1000 #293662324 for sale

SHINKAWA UTC-1000 is a high-performance, modular bonder used to rapidly and accurately assemble and attach components to substrates. It is a hybrid, multi-axis motion system which allows a single operator to set up, program, and control all of the functions of the bonder. It features an automated system controller with an easy-to-use graphical user interface for quick access to the defined bond processes and allows high process outputs with reliable, consistent results. SHINKAWA UTC1000 is capable of bonding several separate components at the same time, including several surface mount devices at once. It also offers fixturing options for bonding various component types, allowing for a higher accuracy of bonding and very high precision placement of components. UTC 1000 features an aerosol-based bonder which allows for a wide range of bonding applications using a variety of materials, including fluxes and adhesives. The aerosol-based bonder ensures accurate and repeatable application of bond materials in specific areas, reducing wasteful use of valuable material. Additionally, it supports fully automated hot and cold processes and is capable of working with multilayer components and boards. The modular bonder is easy to customize for specific technology and assembly requirements. UTC1000 also features high-performance vision systems for automated inspection and verification of inner layers of components, enabling repeatable quality control. It supports multi-camera setups, allowing the operator to closely observe the bonding process and quickly identify problems. This ensures that components are properly assembled and bonded, reducing time and scrap rate. The bonder offers high-speed, high-precision bonding capabilities and easy integration with other SHINKAWA equipment and software, as well as third-party systems. The robust construction ensures a long service life with low maintenance needs, and the overall rigidity of the design ensures that the bond is not affected by vibrations or shock. Furthermore, it features a small footprint and can be used in a variety of industrial environments without disruption to other production processes. Overall, SHINKAWA UTC 1000 is designed to provide an efficient and reliable bonding and assembly solution for a wide range of applications.